Work Package 04 - SAW Technology

Work Package 04 - SAW Technology

Print E-mail
WP04 - SAW Technology

wp04

Objectives

Investigating new technologies for collective low cost fabrication of high frequency SAW devices used as sensors and to allow for advanced device fabrication combining adequate metallization and groove gratings, developing experimental technique of SAW substrate fabrication according to the WP03 specification

Progression and results

Alternative technologies compared to usual UV photolithography implemented in SAW industry have been explored. Particularly, a nanolithography process has been developed to manufacture IDT pursued in SAW devices. Implementation of such technologies should allow reaching lower resolutions and better pattern transfer accuracy.
Hereafter are photos of a NIL-processed wafer (large scale and SAW resonator detail) together with a SEM view illustrating IDT manufactured by nano-imprint lithography (NIL).

NIL

 

NIL2

Different views of the manufactured devices using NIL (a) wafer scale (only one cell was
missed in that run) (b) resonator level, showing the quality of the finger tapping (c) subdetails
of the IDT near the gap, showing the respect of the theoretical operating parameters
and the quality of the finger edges


 

Partnership

  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership
  • Our partnership

SAWHOT Contact
Institut Pierre Vernier
Franche-Comté Innovation et Transfert

24 rue Alain Savary
25000 Besançon
France

Contact Us

Website :